Proceedings / International Symposium on Advanced Packaging Materials.
- Publisher: IMAPS ; IEEE Service Center
- Print ISSN: 1550-5723
- Electronic ISSN: 1550-5723
- OCLC Number: 55472495
- Subject: Electronic packaging Materials Congresses.
- Subject code: T
- Publication history:
Print Holdings
| Archiving Institution | Program | Holdings Description | Retention |
|---|---|---|---|
| HathiTrust (HATHI) | HTDL | 97TH8263 1997; 1997; 98EX153 1998; 99TH8405 1999; 00TH8507 2000; 01TH8562 2001; 02TH8617 2002; 2004; 04TH8742 2004 | permanent |
| University of California, NRLF Shared Print (ZAP) | WEST, WEST Bronze, UCL Shared Print | 1997(3)-1998(4), 2001(7)-2004(9) | 20351231 |