Advances in electronic packaging : proceedings of the ... Joint ASME/JSME Conference on Electronic Packaging / sponsored by the American Society of Mechanical [and] the Japan Society of Mechanical Engineers.
- Publisher: The American Society of Mechanical Engineers
- Print ISSN: 1524-9425
- Electronic ISSN:
- OCLC Number: 30949379
- Subject: Electronic packaging Congresses.
- Subject code: T
- Publication history: Began with 1992?
Print Holdings
| Archiving Institution | Program | Holdings Description | Retention |
|---|---|---|---|
| HathiTrust (HATHI) | HTDL | 1992 v.1; 1992 v.2; 1993 v.1; 1993 v.2; 1995 v.1; 1995 v.2; 1997 v.1; 1997 v.2; 1999 v.1; 1999 v.2; 2001 v.1; 2001 v.2; 2001 v.3; 2005 pt.B | permanent |
| University of Florida (FUG) | Florida Academic Repository (FLARE), Scholars Trust | v.1-2(1993) | 20351231 |