Materials, integration and packaging issues for high-frequency devices.
- Publisher: Materials Research Society
- Print ISSN:
- Electronic ISSN:
- OCLC Number: 244128942
- Subject: Electronic packaging Materials Congresses.
- Subject code: T
- Publication history: [1] (Dec. 1-3, 2003)-
Print Holdings
| Archiving Institution | Program | Holdings Description | Retention |
|---|---|---|---|
| HathiTrust (HATHI) | HTDL | 2003 | permanent |